Kiss-cutting is carried out by rotating machinery that cuts a component into the material, while the backing sheet (silicone layer) stays intact. Kiss-cutting is used mainly in the production of big quantities of self-adhesive components. The advantage of kiss-cutting lays in the fact that the final components remain on a backing sheet after cutting, and they can be easily removed from the backing layer.
Die-cutting is secured by a cutting form prepared in advance that is produced according to a requested shape. Die-cutting is usually used to produce big quantities of the same form and design.